Thermal Simulation Technology for High Density Packaging.

Investigations into packaging technology for membrane-based thermal flow sensors

A new packaging method to mount a membrane-based thermal flow sensor, flush with the surface, is presented. Therefore, a specific design for the housing is shown, which is also adaptable to other conditions. It has been experimentally shown that it is important to mount the sensor flush with the surface. In addition, the experimental results are discussed. If a membrane-based thermal flow senso...

MCM: The High-Performance Electronic Packaging Technology

Modern Electronic Packaging Technology

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...

Semiconductor Packaging Assembly Technology

This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...

Thermal Management in High-Density Power Converters

This paper gives an overview of basic principles of the thermal management in high density power converters. Methods for heat removal on a device and circuit board level are discussed. New packaging technologies for discrete power semiconductors as well as multifunctional board integration techniques are included. A view is given on future 3D integration techniques that take into account the po...